1. Home
  2. 2023-V9-I2
  3. Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark
Statistics

Article Views: 502

PDF Downloads: 109

  • Date of Publication : 2023-06-18 Article Type : Research Article
  • Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark

    Suriya Shaffi Bhat ¹* and Insha Ishteyaq² 

    Affiliation

    ¹ Department of Civil Engineering, Faculty, Tishk International University, Erbil, Iraq
    ² Department of Electronics and Communication Engineering, Islamic University of Science and Technology, J & K, India-192122
    *Corresponding Author


    ORCID :

    Suriya Shaffi Bhat: https://orcid.org/0009-0006-9769-3377 , Insha Ishteyaq: https://orcid.org/0000-0002-2027-7627


    DOI :

    https://doi.org/10.23918/eajse.v9i2p2


    Article History

    Received: 2022-12-14

    Revised: 2023-05-20

    Accepted: 2023-06-08

    Abstract

    In last five decades, the exponential demand in the field of electronic applications is powered by a drastic escalation in the compactness of silicon based complementary metal oxide semiconductor (CMOS) field effect transistor (FETs) and qugumentation in logical performance. But silicon based transistor scaling is now heading to its restraints, intimidating to cease the micro-electronics revolution. Another family of semiconductor materials thus have been under surveil- lance that can be rightly placed to handle this problem: Compound Semiconductors. The spectacular electron transport features of such materials might be point of focus that can lead to development of FETs based on such materials in nano-scale regime. This article provides a speculation in the future of compound semiconductor material-based devices with emphasis on effects of incessant scaling. Whilst aggressive scaling, requirements and constraints that include power dissipation, operating frequency, gain, leakage current must be kept balanced with predictive technologies nodes and also with the fabricating aspects of devices. The scaling restraints requisite a transformation from planar architectures to three-dimensional device structures to cater future performance requirements of CMOS nodes beyond 10 nm. Compound semiconductor materials are progressively waged in various electronic, opto-electronic, and photonic applications due to the prospects of adjusting the properties over a broad parameter domain conveniently by tuning the alloy composition. Ironically, the material properties are also willed by the atomic-scale orientation of compound semiconductors in sub-nanometer scale. Compound semiconductors FET based logic circuits perform 5 folds faster than similar topology circuits based on silicon, whilst dissipating only half of the power. Here a comprehensive review is presented that outlines how compound semiconductor materials mitigate various effects of aggressive scaling in nanometer scale and the adjoining effects.

    Keywords :

    Compound Semiconductors; RF Performance; Scaling; Field Effect Transistors; High Electron Mobility Transistors


    [1]    Ferain I, Colinge CA, Colinge JP. Multigate transistors as the future of classical metal–oxide–semiconductor field-effect transistors. Nature. 2011 Nov 17; 479(7373): 310-6. https://doi.org/10.1038/nature10676 
    Google Scholar

    [2]    Iwai H. Roadmap for 22 nm and beyond. Microelectronic Engineering. 2009 Jul 1; 86(7-9): 1520-8. https://doi.org/10.1016/j.mee.2009.03.129
    Google Scholar

    [3]    Frank DJ. Power-constrained CMOS scaling limits. IBM Journal of Research and Development. 2002 Mar; 46(2.3): 235-44.
    Google Scholar

    [4]    Theis TN, Solomon PM. In quest of the “next switch”: prospects for greatly reduced power dissipation in a successor to the silicon field-effect transistor. Proceedings of the IEEE. 2010 Oct 4; 98(12): 2005-14. https://doi.org/10.1109/jproc.2010.2066531
    Google Scholar

    [5]    Weng YC, Lin YC, Hsu HT, Kao ML, Huang HY, Ueda D, Ha MT, Yang CY, Maa JS, Chang EY, Dee CF. A Novel GaN: C Millimeter-Wave HEMT with AlGaN Electron-Blocking Layer. Materials. 2022 Jan; 15(3): 703. https://doi.org/10.3390/ma15030703
    Google Scholar

    [6]    Kim DH, Del Alamo JA. “30-nm inas phemts with ft=644 ghz and fmax=681 ghz,” IEEE Electron Device Letters. 2010  Aug; 31(8): 806–808. https://doi.org/10.1109/led.2010.2051133
    Google Scholar

    [7]    Harame DL, Ahlgren DC, Coolbaugh DD, Dunn JS, Freeman GG, Gillis JD, Groves RA, Hendersen GN, Johnson RA, Joseph AJ, Subbanna S. Current status and future trends of SiGe BiCMOS technology. IEEE Transactions on Electron Devices. 2001 Nov; 48(11): 2575-94.
    Google Scholar

    [8]    Yu E, Lee WJ, Jung J, Cho S. Ultrathin sige shell channel p-type finfet on bulk si for sub-10-nm technology nodes. IEEE Transactions on Electron Devices. 2018 Mar 5; 65(4): 1290-7.
    Google Scholar

    [9]    Shafi N, Porwal A, Parmaar JS, Bhat AM, Sahu C, Periasamy C. Ultra-Thin Si(1_x) Ge(x) Envelope Layer Induced Hole Quantum Well in Cylindrical Surrounding Gate p-FET with ITRS Considerations. In: 2019 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS). 2022; 360-364. https://doi.org/10.1109/iSES47678.2019.00089 
    Google Scholar

    [10]    Millán J. A review of WBG power semiconductor devices. In: CAS 2012 (International Semiconductor Conference). 2012; 57–66. https://doi.org/10.1109/SMICND.2012.6400696
    Google Scholar

    [11]    Guo X, Xun Q, Li Z, Du S. Silicon carbide converters and MEMS devices for high-temperature power electronics: A critical review. Micromachines. 2019 Jun 19; 10(6): 406. https://doi.org/10.3390/mi10060406
    Google Scholar

    [12]    Alonso AR, Díaz MF, Lamar DG, de Azpeitia MA, Hernando MM, Sebastián J. Switching performance comparison of the SiC JFET and SiC JFET/Si MOSFET cascode configuration. IEEE transactions on power electronics. 2013 Sep 23; 29(5): 2428-40.

    [13]    Ohmachi Y, Ohara T, Kadota Y. A GaAs-on-Si solar cell for space use. In IEEE Conference on Photovoltaic Specialists. 1990 May 21; 89-94. 
    Google Scholar

    [14]    Griffith Z, Urteaga M, Rowell P, Pierson R. 340-440mW Broadband, High-Efficiency E-Band PA's in InP HBT. In 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS). 2015 Oct 11; 1-4.
    Google Scholar

    [15]    Radisic V, Scott DW, Monier C, Wang S, Cavus A, Gutierrez-Aitken A, Deal W. InP HBT transferred substrate amplifiers operating to 600 GHz. In2015 IEEE MTT-S International Microwave Symposium 2015 May 17; 1-3. IEEE.
    Google Scholar

    [16]    Seo S, Cho E, Aroshvili G, Jin C, Pavlidis D, Considine L. Dispersion, High-Frequency and Power Characteristics of AlN/GaN Metal Insulator Semiconductor Field Effect Transistors with in-situ MOCVD Deposited Si 3 N 4. IEICE transactions on electronics. 2010 Aug 1; 93(8): 1245-50.
    Google Scholar

    [17]    Coffie R, Buttari D, Heikman S, Keller S, Chini A, Shen L, Mishra UK. P-capped GaN-AlGaN-GaN high-electron mobility transistors (HEMTs). IEEE Electron Device Letters. 2002 Oct; 23(10): 588-90. https://doi.org/10.1109/led.2002.803764
    Google Scholar

    [18]    Denninghoff DJ, Dasgupta S, Lu J, Keller S, Mishra UK. Design of High-Aspect-Ratio T-Gates on N-Polar GaN/AlGaN MIS-HEMTs for High $ f_ {max} $. IEEE electron device letters. 2012 Apr 16;33(6):785-7. https://doi.org/10.1109/led.2012.2191134
    Google Scholar

    [19]    Jo HB, Yun DY, Baek JM, Lee JH, Kim TW, Kim DH, Tsutsumi T, Sugiyama H, Matsuzaki H. Lg= 25 nm InGaAs/InAlAs high-electron mobility transistors with both fT and fmax in excess of 700 GHz. Applied Physics Express. 2019 May 1; 12(5): 054006. https://doi.org/10.7567/1882-0786/ab1943
    Google Scholar

    [20]    Lin J, Czornomaz L, Daix N, Antoniadis DA, Del Alamo JA. Ultrathin body InGaAs MOSFETs on III-V-on-insulator integrated with silicon active substrate (III-V-OIAS). IEEE Transactions on Electron Devices. 2016 Jun 24; 63(8): 3088-95.
    Google Scholar

    [21]    Zhao X, Lin J, Heidelberger C, Fitzgerald EA, del Alamo JA. Vertical nanowire In GaAs MOSFETs fabricated by a top-down approach. In2013 IEEE International Electron Devices Meeting. 2013 Dec 9; 28-4.
    Google Scholar

    [22]    Addepalli S, Kolla LG, Suda U. Electrical, optical, structural and chemical properties of Al2TiO5 films for high-к gate dielectric applications. Materials Science in Semiconductor Processing. 2017 Jan 1; 57: 137-46. https://doi.org/10.1016/j.mssp.2016.10.019
    Google Scholar

    [23]    Lin TD, Chang YH, Lin CA, Huang ML, Lee WC, Kwo J, Hong M. Realization of high-quality HfO2 on In0. 53Ga0. 47As by in-situ atomic-layer-deposition. Applied Physics Letters. 2012 Apr 23; 100(17): 172110. https://doi.org/10.1063/1.4706261
    Google Scholar

    [24]    Lin YH, Fu CH, Lin KY, Chen KH, Chang TW, Kwo JR, Hong M. Low interfacial trap density and high-temperature thermal stability in atomic layer deposited single crystal Y2O3/n-GaAs (001). Applied Physics Express. 2016 Jul 13; 9(8): 081501. https://doi.org/10.7567/apex.9.081501
    Google Scholar

    [25]    Hudait MK, Zhu Y, Maurya D, Priya S. Energy band alignment of atomic layer deposited HfO2 on epitaxial (110) Ge grown by molecular beam epitaxy. Applied Physics Letters. 2013 Mar 4; 102(9): 093109. https://doi.org/10.1063/1.479483
    Google Scholar



    @article{bhat,suriyashaffiandishteyaq,insha2023,
     author = {Bhat, Suriya Shaffi and Ishteyaq, Insha},
     title = {Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark},
     journal = {Eurasian J. Sci. Eng},
     volume = {9},
     number = {2},
     pages = {12-24},
     year = {2023}
    }
    Copy

    Bhat, S. S., & Ishteyaq, I. (2023). Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark. Eurasian J. Sci. Eng, 9(2),12-24.

    Copy

    Bhat, SS, and Ishteyaq I. "Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark." Eurasian J. Sci. Eng, 9.2, (2023), pp.12-24.

    Copy

    Bhat, S.S. and Ishteyaq, I. (2023) "Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark", Eurasian J. Sci. Eng, 9(2), pp.12-24.

    Copy

    Bhat SS, Ishteyaq I. Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark. Eurasian J. Sci. Eng. 2023; 9(2):12-24.

    Copy

    Under Development

    Under Development

    Under Development

  • Review of Compound Semiconductors Relieving Bottlenecks of Incessant MOSFET Scaling: Heroism or A Race in the Dark